BEL Recruitment 2022 for Trainee Engineer & Project Engineer Posts

Bharat Electronics Limited, BEL released a notification to recruit candidates for Project Engineer & Trainee Engineer posts.  BEL is a navaratna company and one of India’s first professional electronics companies established by the Ministry of Defence. This recruitment is for the temporary based for the Product Development & Innovation Centre (PDIC) & Centres of Excellence (CoE), Bengaluru.

BEL Recruitment 2022 Important Details

BEL Recruitment 2022 Selection Process

• Written Test - 85 marks
• Personal Interview - 15 marks

The venue for the Written Test/ Interview will be Bengaluru.

Click Here for Official Notification - Click Here

Syllabus for Product Development & Innovation Centre (PDIC)

Electronics

Engineer with experience in design & development with knowledge/ competencies in some of the following areas:

• RF and Microwave: Basic RF circuits, Receivers (VLF, HF to microwave frequencies), Receiver front end design & testing, Passive and active components of RF receiver and Exciter chain, low noise amplifiers, Receivers, Exciters, Frequency synthesizers, low and medium Power amplifiers, combiners, splitters. Simulation and design of narrow, and wide Band antennas starting from the HF band. Omni and Directional antennas, Multi-band antennas. Familiarity with the usage of any RF simulation tool will be an advantage.
• Power Electronics: Experience in PCB design tools like Allegro/PADS/Altium and familiarity with MATLAB tools. Experience designing and developing digital and analog electronics for power converters, voltage/current sensing and signal conditioning, Op-amp based circuit, and design of power electronics products using high power MOSFETs for Battery Chargers, AC-DC converters, DC-DC Converters.
• Embedded Products: Design of Embedded Systems with 16/32/64 bit X86/RISC/ARM/DSP Processor, with experience in Microcontroller, FPGA based hardware design, VHDL /Verilog Coding, familiarity with Vivado or equivalent tool and testing. SOC/FPGA-based board Design, C, C++, Embedded Linux, High-speed Transceivers, Memories (DDR3, DDR4, QDR), Ethernet (1G/10G,100G), PCIe, High-speed ADC/DAC.
• Experience in developing Device Drivers, BSP Development in ARM, PowerPC, etc with Windows/Linux/VxWorks operating systems with knowledge of debugging tools & emulators. Experience in kernel programming like Memory Mgmt, Threads/Processes, IPCs, Synchronization, Interrupts, Boot Sequence, etc. will be an added advantage. Knowledge of buses & external Interfaces (VPX, PCIe, 1553, ARINC…). Working Knowledge in FPGA-based SoC will also be an added advantage.  Communication Products: Knowledge of Networking Protocols, SIP protocols, Voice Media processing (Audio, Video Codec), Software Defined Networks, Wireless Networking Protocols, 4G, 5G, IP Multi-Media Services (IMS), Digital Modulations, satellite communications, electro-optics design.

Mechanical

Candidate should have experience in modeling and design of mechanical parts/ housings, product engineering, and thermal and structural analysis of electronic product enclosures using any 3D software & analysis tool. Should have experience in engineering documentation and any ERP software like SAP. Knowledge of tools like Solid Works, Auto CAD, CATIA, ANSYS, or similar tools for product design will be preferred. Should also have knowledge of materials for product design for various requirements including defense applications.

Computer Science:

• Candidate should have experience in Driver development on ARM-based Micro-controller, BSP & Device driver development in the Linux Operating System or any RTOS and Port to custom hardware, and Development of APK (Android Applications) using the Android Studio.
• Usage of Languages like C, Embedded C, C++, JAVA 2, J2EE, Javascript, PHP, CSS, HTML, and python. Usage of software development /debugs tools like Qt, Net Beans, Eclipse, Visual Studio code, Spring too suite, Brackets, and memory management techniques.
• Knowledge of Frameworks like Angular JS, React JS, Spring, Hibernate, and Spring boot is preferred.
• Domain Experience in Front End Development, Backend development, Full stack development GUI development using Java, and QT. Knowledge of interface protocols like I2C, SPI, etc.
• Working experience in I/O interface development like UART, GPIO, Ethernet, ADC, etc.  Experience in Boot Loader Concepts, Uboot, Customization and porting on hardware, and Bare Metal Coding for Micro-controllers. Knowledge of AI, Machine Learning algorithms, Neural Networks, and Robotics Automation will also be preferred.

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Candidate(s) applying for Centres of Excellence (CoE)

Trainee Engineer-I

Electronics

• Engineer with experience in design, development, and testing with knowledge/competencies in any of the following areas:  Digital Electronics Domain: Microcontroller/DSPs/FPGA-based hardware design with High-speed Transceivers/ Memories (DDR3, DDR4, QDR)/ Ethernet (1G/10G,100G) and other interfaces like SPI/UART/I2C/GPIO. Experience in Embedded C/VHDL /Verilog programming languages, digital and analog electronics-based mixed-signal design, and testing, and board bring-up. Familiarity with Vivado or equivalent tools, PCB design tools like allegro, and OrCAD tools will be an added advantage.
• RF and Microwave domain: Basic RF circuits, Receivers (VLF, HF to microwave frequencies), Receiver front end design & testing, Passive and active components of RF receiver and Exciter chain, low noise amplifiers, Receivers, Exciters, Frequency synthesizers, low and medium Power amplifiers, combiners, splitters. Familiarity with the usage of any RF simulation tools like ADS/ System Vue/Microwave Office AWR will be an advantage.
• Communication domain: Knowledge of Digital Modulation design and testing, knowledge of Wired/Wireless Networking Protocols, SIP protocols, knowledge of MATLAB or similar simulation tools. Awareness of Radio communication and satellite communication will be an added advantage.

Mechanical

• Tools: Exposure and usage of Auto CAD/Solid Works, ANSYS, CATIA, or similar tools  Modeling: Exposure to 3D modeling tools, DXF/DWG modeling of PCBs and Electronic systems  Design: Exposure to Product Development of electronics systems, Thermal Simulation& Analysis, PCB Modeling, 3D modeling.

Computer Science:

• Languages: Knowledge of Embedded C/C/C++  OS: Exposure to RTOS/Linux porting  Software: Exposure to development of BSP/Device Drivers/Application Development, Software for Microcontrollers/DSPs based platforms  Protocols: Knowledge in TCP/IP, L2/L3 Layers processing.

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Project Engineer-I

Electronics

• Engineer with experience in design, development, and testing with knowledge/competencies in any of the following areas:  Digital Electronics Domain: Microcontroller/DSPs/ FPGA based hardware design with High-speed Transceivers/ Memories (DDR3, DDR4, QDR)/ Ethernet (1G/10G,100G) and other interfaces like SPI/UART/I2C/GPIO. Experience in Embedded C/VHDL /Verilog programming languages, digital and analog electronics-based mixed-signal design and testing, and board bring-up. Familiarity with Vivado or equivalent tools, PCB design tools like allegro, and OrCAD tools will be an added advantage.
• RF and Microwave domain: Basic RF circuits, Receivers (VLF, HF to microwave frequencies), Receiver front end design & testing, Passive and active components of RF receiver and Exciter chain, low noise amplifiers, Receivers, Exciters, Frequency synthesizers, low and medium Power amplifiers, combiners, splitters. Familiarity with the usage of any RF simulation tools like ADS/ System Vue/Microwave Office AWR will be an advantage.
• Communication domain: Knowledge of Digital Modulation design and testing, knowledge of Wired/Wireless Networking Protocols, SIP protocols, knowledge of MATLAB or similar simulation tools. Awareness of Radio communication and satellite communication will be an added advantage.

Mechanical:

• Tools: Experience in Auto CAD/Solid Works, ANSYS, CATIA, or similar tools
• Modeling: Experience in 3D modeling tools, DXF/DWG modeling of PCBs and Electronics enclosures
• Design: Product Development of electronics systems, Product Design for EMI/EMC, Thermal Simulation& Analysis, Structural Simulation& Analysis for Electronics systems, Design of VPX/VME-based systems, PCB Models design, 3D modeling, QC/QA test reports, and documentation.

Computer Science:

• Languages: Experience in Embedded C/C/C++
• OS: Porting of U-boot& boot loader in embedded platforms, RTOS/Linux/Integrity or similar OS porting
• Software: Experience in Embedded software for Microcontrollers/DSPs/MPSoC-based platforms, BSP/Device Drivers/Application Development, Knowledge of H/W interfaces (SPI/UART/I2C/GPIO, etc.), Exposure to QT Applications, Software processing of Interrupts/Exceptions/Multithread/Real-time Processing, etc.
• Protocols: Experience in TCP/IP, Networking/Routing protocols, L2/L3 Layer processing, etc.

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